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Products
PCBA
Multilayer PCB
HDI PCB
Rigid-Flex PCB
RF PCB
Semiconductor Test PCB
5G Communication PCB
◆Layer Count:22L
◆Material:TU-883
◆Board Thickness:3.2mm±0.2mm
◆Min.Trace/Space:3/3mil
◆Copper Type: HVLP
◆Via-in-Pad:VIPPO
◆Back Drill:12 sets
◆Impedance:20 lines
Optical module products
◆Layer Count:10L
◆Product Model:400Gbps QSFP-DD
◆Material:M6(R-5775)
◆Finished Thickness:1.0±0.075mm
◆Min.Trace/Space:3/3mil
◆Micro vias:L1-L2,L2-L3,L8-L9,L9-L10
◆Buried vias:L3-L8
◆Plug shape tolerance:±0.05mm
◆Copper filled depression:less than 15um
◆Surface Finish:ENEPIG + Gold Finger