Manufacturing Capability

Key Parameters Of Normal Rigid PCB
Item 项目		标准 Standard	极限 Advanced
板层数 Layer Count	Max Layer Count	36L	48L
板厚 Board Thickness	Max PCB Thickness	5.0mm	6.5mm
板厚 Board Thickness	Min PCB Thickness	0.2mm	0.1mm
成品尺寸 Finished Size	Max Finished Size	24*35inch	24.5*47inch
成品尺寸公差 Board Size Tolerance	Min Routing Tolerance	±0.1mm	±0.05mm
最大基铜厚度 Max Base Copper Weight	Inner	12OZ	20OZ
最大基铜厚度 Max Base Copper Weight	Outer	12OZ	20OZ
最小线宽/线距 Min Trace/Spacing	Outer	75/75um	50/50um
最小线宽/线距 Min Trace/Spacing	Inner	75/75um	45/45um
机械钻孔孔径 Drilling Size	Min Mechanical Drilling	6mil	6mil
最小机械钻孔PAD Min Mechanical Via Pad	Inner	0.45mm	0.40mm
最小机械钻孔PAD Min Mechanical Via Pad	Outer	0.40mm	0.35mm
孔径公差 Press Fit Hole Tolerance	Min Press Fit Hole Tolerance	±2mil	±2mil
BGA Pitch	Min BGA Pitch	0.45mm	0.35mm
板厚孔径比 PCB Aspect Ratio	Max PCB Aspect Ratio	10:1	20:1
阻焊桥 Solder Mask Dam	Min Solder Mask Dam	3.5mil	3mil
芯板厚度 Core Thickness	Min Core Thickness	0.05mm	0.05mm
翘曲度 Bow & Twist	Min Bow & Twist	0.75%	0.50%
阻抗公差 Impedance Control	Min Impedance Tolerance	±10%	±8%
表面工艺 Surface Treatment	Surface Treatment	Electronic Gold Plating、ENIG、Hard Gold Plating、Gold Finger、LF-HAL、OSP、ENEPIG、Soft Gold Plating、Immersion Silver、Immersion Tin、ENIG+OSP、ENIG+G/F、Flash Gold+G/F、Immersion Silver+G/F、Immersion Tin+G/F、HASL
材料 Material	Normal TG FR-4	Shengyi, ITEQ, KB, Nanya
	Middle TG FR4	Shengyi S1000H, ITEQ IT158, Nanya NY2150
	High TG FR4	Shengyi S1000‐2M,S1190，EMC EM827，Isola 370HR，185HR，ITEQ IT180A，TUC TU-768，TU-862 HF，Panasonic R1755V
	High Speed Materials	Mid-Loss(1-5G)：Isola FR408HR，TU-862 HF，ITEQ IT-170GRA1，EMC EM-355(D)，EMC EM-370(5) Low-Loss(5-10G)：EMC EM828, EM888(S), EM888(K)，TU-872 SLK，Nelco N4103-13/13 EP/SI/EPSI Very-Low-Loss(10-25G)：Isola I‐Speed, I‐Tera MT，Panasonic R-5775G/M6G，ITEQ IT-968 Ultra-Low-Loss1(25-40G)：Panasonic R-5775N/M6N，R-5785/M7 Ultra-Low-Loss2(40-56G)：Panasonic R-5785N/M7N， Nelco Meteorwave4000
	High Frequency Materials	Rogers RO4350, RO4003C，RO3010，Taconic RF‐30, RF‐35, TLC, TLX, TLY，Taconic 601, 602, 603, 605
	Metal Substrate	Shengyi SAR20, Yugu YGA，T110/1/2，T112B/C，VT-4A1/2/3/5，1KA04/6/8

Key Parameters Of HDI
Item 项目		标准 Standard	极限 Advanced
盲孔结构 Structure		6+N+6	7+N+7
叠孔结构 HDI Stack Via		Any Layer(14L)	Any Layer(16L)
最小线宽/间距 Min Trace/Spacing	Inner	50/50um	40/40um
最小线宽/间距 Min Trace/Spacing	Outer	50/50um	40/50um
纵横比 PCB Aspect Ratio	Max PCB Aspect Ratio	0.8:1	1:1
钻孔尺寸 Drilling Size	Min Laser Drilling	4mil	3mil
线宽/线距 Trace/Spacing	Inner Layer Min Trace/Spacing	0.25mm	0.17mm
线宽/线距 Trace/Spacing	Outer Layer Min Trace/Spacing	0.25mm	0.17mm
最小芯板厚度 Min. Core Thickness		40um	40um
最小BGA Pitch Min BGA Pitch		0.4mm	0.3mm

Key Parameters Of Semiconductor Test Board
Item 项目		标准 Standard	极限 Advanced
板层数 Layer Count	Max Layer Count	30	50
成品尺寸 Finished Size	Max Finished Size	21*26	24*30
板厚 Board Thickness	Max PCB Thickness	5.0mm	7.0mm
板厚公差 Board Thickness Tolerance	Min Thickness Tolerance	±7%	±5%
Min DUT Pitch		0.45mm	0.35mm
压合次数 Multiple Laminations		2	4
平整度 Flatness (Symmetrical Construction)	Min Flatness	0.50%	0.20%
纵横比 PCB Aspect Ratio	Max PCB Aspect Ratio	12:1	25:1
阻抗公差 Impedance Control	Min Impedance Tolerance	±10%（≥50Ω） ±5Ω（<50Ω）	±5%（≥50Ω） ±3Ω（<50Ω）

Key Parameters Of Rigid-Flex And Flex PCB
Item 项目		Flex	Rigid-Flex
板层数 Layer Count	Max Layer Count	12L	20L
成品尺寸 Finish Size	Max Finished Size	9inch*98inch	20inch*24inch
成品尺寸公差 Board Size Tolerance	Min Routing Tolerance	±0.05mm	±0.1mm
最小线宽/线距 Min Trace/Spacing	Outer	3/3mil	3/3mil
最小线宽/线距 Min Trace/Spacing	Inner	2.5/2.5mil	3/3mil
板厚 Board Thickness	Max PCB Thickness	0.5mm	6.0mm
板厚 Board Thickness	Min PCB Thickness	0.06mm	0.25mm
板厚公差 Board Thickness Tolerance	Min Thickness Tolerance	±0.03mm	±0.1mm
机械钻孔孔径 Drilling Size	Min Mechanical Drilling	0.1mm	0.15mm
孔径公差 Press Fit Hole Tolerance	Min Press Fit Hole Tolerance	±2mil	±2mil
阻抗公差 Impedance Control	Min Impedance Tolerance	/	±10%（≥50Ω） ±5Ω（<50Ω）
最大基铜厚度 Max Base Copper Weight	Inner	2OZ	6OZ
最大基铜厚度 Max Base Copper Weight	Outer	2OZ	3OZ
翘曲度 Bow & Twist	Min Bow & Twist	/	0.50%
表面工艺 Surface Treatment	Surface Treatment	LF-HAL、HASL、ENIG、ENEPIG、Electronic Gold Plating、Soft Gold Plating、Hard Gold Plating、Immersion Silver、Immersion Tin、OSP、Gold Finger
补强 Stiffener	Stiffener Type	FR4/PI/PET/SUS/PSA	/
柔性材料 Flex Material		Shengyi SF305，Panasonic RF-775，Panasonic RF-777，Dupont AP，Thinflex

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