Technology

PCB Design Manufacturing Capability PCB Assembly

About SMT Factory:

Yuwei Electronic Technology PCBA factory is located in Jiangxi province, focusing on prototype and Small&Middle volume SMT production, including SMT, post welding, assembly, testing one-stop service.

· SMT production lines: 8 SMT production lines with a factory area of 9000 square meters

· High-end equipment: FUJI XPF, NXT3, AIMEX III, AOI/SPI/XRAY/ intelligent first-piece tester, etc

· Quick delivery: delivery in 36 hours at the earliest

· Minimum assembly size: 03015,01005,0201,0402

· One-stop innovation platform: PCB design, Production, Assembly, Components supply

 

Production Equipment:

Yuwei Electronic Technology SMT Factory: the factory is equipped with central air conditioner, air shower room, anti-static treatment, constant temperature and humidity warehouse, etc.

It is equipped with new imported Fuji XPF, NXT3, automatic solder paste printing machine, ten-temperature reflow furnace, wave soldering, AOI/SPI/XRAY/ intelligent first piece tester.




Processing Capacity:

Existing 8 SMT production lines, equipped with advanced imported Fuji XPF, NXT3, automatic solder paste printer, ten zones reflow ovens, high-end equipment, AOI, SPI SMT capacity 8.5 million solder joints/day, especially good at high precision, high complexity of PCBA.



Yuwei Electronics Techonlogy SMT Welding Quality Control:

The production line is equipped with high-end equipment for high-precision and high-yield processing.

Conduct quality inspection and control at each processing link to prevent defective products from flowing into the next link.Set up a number of quality personnel throughout the sampling inspection.

(1) Intelligent first article detector: detect wrong material, missing piece, polarity, direction, screen printing, etc., mainly used in the first article detection;Compared with manual detection, the accuracy is higher and the speed is increased by 45%+

(2) AOI: detect problems after loading: short connection, leakage, polarity, displacement, wrong parts

(3) X-ray: BGA, QFN and other devices for open, short circuit detection

(4) SPI- automatic 3D solder paste thickness gauge: detect printing quality problems of various kinds of solder paste, such as missing printing, less tin, more tin, even tin, deviation, bad shape, surface pollution, etc