Product size 350*360*2.0mm
14-Layers PCB
Minimum component specification 0201
Product process characteristics:
More components (BGA), more types of components (250 kinds), the quality of the SMT requirements are relatively high.
SMT(B/T)+ Pressure Welding +DIP
Product size 250*320*3.0mm
18-Layers PCB
Minimum component specification 0201
Product process characteristics:
High speed connector need to do Pressure Welding; Board is thicker, use selective wave soldering plug-in, ensure that the penetration rate of plug-in tin 100%.